High barrier packaging, that is, high barrier properties of packaging materials, application and progress of the current industrialization or industrial production prospects of the barrier material are pvdc, evoh, pen, nitrile resin, polyamide. Pvdcpvdc (polyvinylidene chloride) is characterized by low permeability, barrier properties and chemical resistance.
As early as 40 years ago, high barrier technology has begun to produce. The United States in the nineteen fifties has been used in the extrusion of polyethylene film composite metal foil as a barrier packaging material. Also included in the metal foil substrate processing technology, because the foil material is very thin, and the barrier is very good, so at that time that the high barrier industry has been formed.